About Honda

Honda believes in The Power of Dreams. But believing isn’t enough. As Soichiro Honda said: “Action without philosophy is a lethal weapon; philosophy without action is worthless.” See how we are bringing this idea to life. Click here to learn more. 

Scholarship Overview

The Thurgood Marshall College Fund (TMCF) and American Honda Motor Company are proud to offer financial assistance to outstanding students attending one of TMCF’s member-schools that include 47 publicly-supported Historically Black Colleges and Universities (HBCUs) and Predominantly Black Institutions (PBIs). Five (5) scholars will be selected to receive a spring scholarship up to $5,000 for 2020-2021 academic school year (which can only be applied to verifiable costs associated with average tuition and usual fees).

Eligibility Requirements:

  • Be enrolled full-time as a freshman, sophomore, junior or senior at a TMCF member-school during the 2020-2021 academic school year.
  • Open to engineering, supply chain, and manufacturing or business-related majors.
  • Current cumulative grade point average of 3.0 or higher.
  • Able to demonstrate leadership abilities.
  • Able to demonstrate a financial need.
  • Be a U.S. Citizen or legal permanent resident with a valid permanent resident card or passport stamped I-551.

How to Apply

All Applicants Must:

  • Provide a copy of the 2020-2021 FAFSA Student Aid Report.
  • Provide the transcript (official or unofficial) for your most recently completed academic term-this should include your end of Spring/ 2020) grades and cumulative GPA.
  • Please provide an email address for one recommender to complete a character reference form. They will be required to answer three questions regarding your character reference.
  • Answer the following statement. (Maximum of 500 words per question):
    • Honda celebrates innovative problem solving that helps people, communities, and the world. Describe how your education would allow you to leverage technological problem-solving in the car industry.

Application Deadline
This application is closed. 

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